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ADE 9500 Ultra Gage

  • Dimensional measurement for 500nm design rule
  • Measure 8700 data points in under 60 seconds, 2-D control map
  • Measurements - Thickness: Center point, five point, full wafer scan
  • Shape: Bow and Warp using 3-point or Best-Fit references
  • Global Flatness: SEMI GBI, TIR, FPD, FPD percent, 5-Point TTV
  • Site Flatness: All SEMI M1 standards with 8-30 mm site size and variable offsets
  • Thickness - Accuracy: +/-0.50 micro-meters
  • Repeatability: 0.15 micro-meters
  • Absolute Range: Nominal +/-125 micro-meters
  • Global Flatness - Accuracy: +/-0.15 micro-meters
  • Repeatability: 0.05 micro-meters
  • Site Flatness - Accuracy: +/-0.15 micro-meters
  • Repeatability: 0.05 micro-meters
  • Shape (Bow/Warp) - Accuracy: +/-(4.0 + 5 percent of reading) micro-meters
  • Repeatability: (1.3 + 1 percent of reading) micro-meters
  • Absolute Range: +/-150 micro-meters
  • Wafer diameters supported: 100,125,and 200mm (polished or patterned)
  • Wafer Thickness: 400 to 1,000 micro-meters