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Applied Materials Centura Xe+ RTP (S/N: R592)

• Manufactured in 2000
• Installed in December 2000
• Configured for 200mm Wafers
• Narrow Body, Tilt Out Load Locks
• HP Transfer Robot
• 2ea RTP XE+ RTP Chambers
o Position A: Selective Oxidation
o Position B: ISSG/RTO/RTA Thin & Thick Oxide
o Sekidenko 2000 Pyrometers
• Position E: Fast Cool Down
• Position F: Fast Cool Down
• Gas Panel with Unit UFC-8160 MFC’s
• Gases for Chambers A & B:
• N2 @ 10 SLM
• O2 @ 2 SLM
• O2 @ 20 SLM
• Ar @ 10 SLM
• N2O @ 10 SLM
• H2 @ 10 SLM
• H2 @ 1 SLM
• NH3 @ 10 SLM
• N2 @ 10 SLM
• SECS / GEM Interface
• Synergy V452
• Power Requirements: 208VAC, 3 Phase, 4 Wire, 50/60 Hz
• Max. System Rating: 115 KVA
• Ampere Rating Largest Load: 280A
• 2ea Ebara A10S Dry Vacuum Pumps
• 2ea Ebara A70W Dry Vacuum Pumps, Rebuilt by Ebara